Formation of silicate structures in Cu-containing silica xerogels
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abstract
Using infrared absorption and Raman spectroscopy, the structure of SiO2 sol-gel samples containing copper were analyzed as a function of air heat treatments. The weight composition of the samples was 70(SiO2)-30(CuO) and the thermal treatments were carried out in air at various temperatures in the range of 100-600 °C. It was found that the Cu might be incorporated into the SiO2 matrix at least in two ways: forming oxide particles and forming metasilicatelike structures. The copper metasilicate found had the chemical formula, Cu6[Si6O18] · 6H2O, which is known as dioptase with a thermal stability at temperatures up to 600 °C.