Effect of Cu-electrodeposition on the magnetic properties of Sr-hexaferrite with porous structure Article uri icon

abstract

  • The magnetic behavior of the strontium hexaferrite (SrM) with foam structure was studied when copper (Cu) coats its surface. Copper was successfully deposited on the walls of the magnetic foam using the electrodeposition method. Results suggest that copper begins to nucleate on the hexaferrite grains because of a two steps process; the one based on a driving force of the Cu ions by the effect of the electric field, and secondly, the deposition of copper atoms on the non-conductive SrM surface. The SrM and Cu show a hard interaction which modifies the magnetic properties of the SrM foam as copper covers its surface. Hence, the coercive field (H c ) and the magnetization squareness (M r /M s ) have a trend to increase up to a Cu/SrM weight ratio close to 0.5. The dM/dH, M curves (SFD) indicate the presence of two uncoupled magnetic contributions. The copper fixes the magnetic moments of iron at the surface increasing the switching field these particles, whereas in the inner particles the magnetization rotates easily resulting in a widening of the SFD curve. © 2019 Elsevier B.V.

publication date

  • 2019-01-01