abstract

• Nondestructive infrared detection of solder defects in solenoid coil connectors was investigated. A detailed experimental setup and a meticulous and repeatable experimental procedure were developed. The experimental methods were firmly based on the application of heat transfer science. Time averaged excess temperature ((Formula presented.)) was the sole discrimination parameter, and a difference larger than 2°C between good and defective solders was conservatively considered for good discrimination. Analysis of variance determined the minimum differences in (Formula presented.) between good and defective solder joints. The effects in discriminability of heating time (th), time integration interval length (ti), region of interest (ROI) geometry, and solder radiative properties were investigated. A rectangular ROI tightly enclosing the good solder was found as the best discrimination ROI. Matte black paint increasing radiative emission of solder joints significantly reduced discriminability. The defects were discriminated from the good solder for a rectangular ROI, th = 78 s, and ti = 20 s. Moreover, an excellent total inspection time of 34 s per solenoid coil is obtained by considering a well-controlled inspection environment during manufacturing, severe defects detection, and a possible 1°C difference for discrimination. Several aspects of the novel inspection procedure developed can greatly benefit the thermal imaging scientific community. © The Author(s) 2022.

authors

• Girón-Palomares B.
• Hernández-Guerrero A.
• Oviedo Tolentino Francisco

publication date

• 2022-01-01

published in

• Advances in Mechanical Engineering  Journal

keywords

• electronics inspection; experimental analysis; statistical analysis; thermal imaging; thermal radiation; Transient thermal analysis; visible solder joints

Digital Object Identifier (DOI)

• 10.1177/16878132221107453

PubMed ID

start page

end page

volume

• 14

issue

• 6